Mumbai : L&T Semiconductor Technologies
Ltd (LTSCT)), a wholly-owned subsidiary of Larsen
& Toubro (L&T), has announced that it is joining the imec ‘Automotive Chiplet Program’ (ACP), a
pre-competitive research initiative uniting stakeholders across the global
automotive value chain.
ACP evaluates chiplet architectures and advanced packaging
technologies to meet automakers’ demanding performance, functional-safety,
reliability and lifecycle requirements — while enabling the flexibility,
scalability and cost efficiencies associated with chiplet-based systems.
For decades, automakers have relied on semiconductors to power
vehicle electronics. However, traditional monolithic SoC approaches are increasingly challenged by the compute and bandwidth demands of advanced
driver-assistance systems (ADAS), software-defined vehicles (SDVs) and next-generation in-vehicle infotainment (IVI). Chiplets — modular silicon building blocks optimised for
specific functions and
interconnected through advanced 2.5D and 3D packaging
— offer a new paradigm
that delivers higher
performance per watt,
faster time-to-market and greater supply-chain resilience.
Sandeep Kumar,
Chief Executive - LTSCT, said: “Chiplets represent a fundamental shift in
how performance and integration are delivered in automotive systems. As vehicle
architectures become increasingly software-defined, modular and scalable
hardware becomes critical”.
He further added: “Through the collaboration with imec
and the ACP partners, LTSCT aims
to help define the standards and reference designs that will drive the next
generation of high-performance, energy-efficient automotive platforms. Our participation will emphasise
safety-critical compute partitions, high-bandwidth die-to-die links and robust
test/monitoring concepts from wafer to in-field operation. We intend to contribute practical viewpoints from productisation
— covering qualification, diagnostics and lifecycle management in real
automotive environments”.
“We are delighted to welcome LTSCT — India’s
largest semiconductor product
company — to the Automotive Chiplet Program”, said Mr Bart Placklé, Vice President of
Automotive Technologies at imec. “Transitioning to chiplet architectures is
prohibitively expensive if pursued by OEMs in isolation. Commercial viability depends
on industry-wide alignment
around interoperable chiplet standards that allow
carmakers to integrate off-the-shelf and proprietary chiplets seamlessly into
unique systems. The Chiplet reduces vendor lock-in, enhances supply-chain flexibility and improves
energy and spatial
efficiency — key enablers
of more compact and sustainable vehicle platforms”, he added.
The ‘Automotive Chiplet Program’ leverages
imec’s world-leading expertise
in advanced
2.5D/3D packaging and its broad ecosystem across the semiconductor
and automotive industries.
With its entry into the imec ‘Automotive Chiplet Program’, LTSCT reinforces its commitment
to advancing India’s role in the global semiconductor ecosystem. By
contributing to open chiplet standards and collaborating with leading
automotive and technology innovators, LTSCT aims to accelerate the path toward
safer, smarter and more sustainable vehicles worldwide.